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[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Study on thermal design due to downsizing of power module using coupled electrical-thermal-mechanical analysis
Yamada, Yasutaka, Yu, Qiang, Takahashi, Tomohiro, Takagi, YusukeYear:
2012
Language:
english
DOI:
10.1109/emap.2012.6507917
File:
PDF, 451 KB
english, 2012