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[IEEE 2006 8th Electronics Packaging Technology Conference - Singapore (2006.12.6-2006.12.8)] 2006 8th Electronics Packaging Technology Conference - Solid state growth kinetics of complex intermetallics in the Pb-free ball grid array (BGA) solder joint for MEMS packaging

Alam, M., Dan, Yang, Wu, B., Chan, Y., Rufer, L., Bailey, C.
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Year:
2006
Language:
english
DOI:
10.1109/eptc.2006.342717
File:
PDF, 1.04 MB
english, 2006
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