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[IEEE IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (7-11 July 2003)] Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003 - Flip chip silicon fracture mechanism with 3-point bend metrology on flip chip ball grid array

Kam Meng Chong,, Hang Keang Lim,, Chin Seng Ong,
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Year:
2003
Language:
english
DOI:
10.1109/ipfa.2003.1222746
File:
PDF, 381 KB
english, 2003
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