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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Multi-physics computer simulation of the electromigration phenomenon
Zhu, Xiaoxin, Kotadia, Hiren, Xu, Sha, Lu, Hua, Mannan, Samjid H., Chan, Y. C., Bailey, ChrisYear:
2011
Language:
english
DOI:
10.1109/icept.2011.6066874
File:
PDF, 1.57 MB
english, 2011