A Comprehensive LER-Aware TDDB Lifetime Model for Advanced Cu Interconnects
Stucchi, Michele, Roussel, Philippe J., Tokei, Zsolt, Demuynck, Steven, Groeseneken, GuidoVolume:
11
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2011.2121909
Date:
June, 2011
File:
PDF, 1.16 MB
english, 2011