[IEEE 2008 IEEE 9th VLSI Packaging Workshop of Japan -...

  • Main
  • [IEEE 2008 IEEE 9th VLSI Packaging...

[IEEE 2008 IEEE 9th VLSI Packaging Workshop of Japan - Kyoto, Japan (2008.12.1-2008.12.2)] 2008 IEEE 9th VLSI Packaging Workshop of Japan - Electrochemical migration of electronic components at sea environments - characterizations and solutions

Hussain, Mohamed A., Khoshnaw, Fuad M.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2008
Language:
english
DOI:
10.1109/vpwj.2008.4762223
File:
PDF, 1.29 MB
english, 2008
Conversion to is in progress
Conversion to is failed