![](/img/cover-not-exists.png)
[IEEE 2008 IEEE 9th VLSI Packaging Workshop of Japan - Kyoto, Japan (2008.12.1-2008.12.2)] 2008 IEEE 9th VLSI Packaging Workshop of Japan - Electrochemical migration of electronic components at sea environments - characterizations and solutions
Hussain, Mohamed A., Khoshnaw, Fuad M.Year:
2008
Language:
english
DOI:
10.1109/vpwj.2008.4762223
File:
PDF, 1.29 MB
english, 2008