![](/img/cover-not-exists.png)
[IEEE 2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Glasgow, United Kingdom (2013.09.3-2013.09.5)] 2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - A unified model of metallic filament growth dynamics for conductive-bridge random access memory (CBRAM)
Qin, Shengjun, Zhang, Jinyu, Yu, ZhipingYear:
2013
Language:
english
DOI:
10.1109/sispad.2013.6650645
File:
PDF, 256 KB
english, 2013