![](/img/cover-not-exists.png)
Lead-free solder flip chip-on-laminate assembly and reliability
Zhenwei Hou,, Guoyun Tian,, Hatcher, C., Johnson, R.W., Yaeger, E.K., Konarski, M.M., Crane, L.Volume:
24
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/6104.980037
Date:
October, 2001
File:
PDF, 355 KB
english, 2001