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[IEEE Asia and South Pacific Conference on Design Automation, 2006. - Yokohama, Japan (Jan. 24, 2006)] Asia and South Pacific Conference on Design Automation, 2006. - A multi-technology-process reticle floorplanner and wafer dicing planner for multi-project wafers
Chien-Chang Chen,, Wai-Kei Mak,Year:
2006
Language:
english
DOI:
10.1109/aspdac.2006.1594780
File:
PDF, 410 KB
english, 2006