![](/img/cover-not-exists.png)
Calculating effective board thermal parameters from transient measurements
Szekely, V., Rencz, W., Torok, S., Ress, S.Volume:
24
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/6144.974947
Date:
January, 2001
File:
PDF, 260 KB
english, 2001