[IEEE 2006 7th International Conference on Electronic...

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[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - Theoretical and Experimental Study on the Thermally Induced Packaging Effect in COB Structures

Li, Ming, Huang, Qing'an, Song, Jing, Tang, Jieying, Chen, Fanxiu
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Year:
2006
Language:
english
DOI:
10.1109/icept.2006.359778
File:
PDF, 4.41 MB
english, 2006
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