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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Failure mechanisms of Ni/Sn3.0Ag0.5Cu/OSP flip chip solder under high current stressing
Ye, Song, Huang, Mingliang, Chen, Leida, Zhou, ShaomingYear:
2011
Language:
english
DOI:
10.1109/icept.2011.6066903
File:
PDF, 1.92 MB
english, 2011