[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Linz, Austria (2011.04.18-2011.04.20)] 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Assessment of thermo mechanical properties of crosslinked epoxy mesoscale approach — Preliminary results
Tesarski, Sebastian J., Wymyslowski, Artur, Holck, OleYear:
2011
Language:
english
DOI:
10.1109/esime.2011.5765833
File:
PDF, 2.08 MB
english, 2011