Effects of Voiding on the Degradation of Microvias in High...

IEEE Transactions on Components Packaging and Manufacturing Technology 2014 / 8 Vol. 4; Iss. 8

Effects of Voiding on the Degradation of Microvias in High Density Interconnect Printed Circuit Boards Under Thermomechanical Stresses

Bakhshi, Roozbeh, Azarian, Michael H., Pecht, Michael G.
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Volume:
4
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2014.2322105
Date:
August, 2014
File:
PDF, 1.54 MB
english, 2014
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