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[IEEE 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Como, Italy (24-26 April 2006)] 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Microstructural Considerations for Ultrafine Lead Free Solder Joints
Zhiheng Huang,, Conway, P.P., Thomson, R.C.Year:
2006
Language:
english
DOI:
10.1109/esime.2006.1643981
File:
PDF, 8.50 MB
english, 2006