Low temperature bonded Cu/LCP materials for FPCs and their...

IEEE Transactions on Components and Packaging Technologies 2005 / 12 Vol. 28; Iss. 4

Low temperature bonded Cu/LCP materials for FPCs and their characteristics

Nanbu, K., Ozawa, S., Yoshida, K., Saijo, K., Suga, T.
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Volume:
28
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2005.859746
Date:
December, 2005
File:
PDF, 681 KB
english, 2005
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