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[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - 3D substrate innovation for complex high pin count flip-chip applications
Solberg, Vern, Oganesian, VageYear:
2010
Language:
english
DOI:
10.1109/estc.2010.5642880
File:
PDF, 645 KB
english, 2010