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[IEEE 2006 8th Electronics Packaging Technology Conference - Singapore (2006.12.6-2006.12.8)] 2006 8th Electronics Packaging Technology Conference - On the study of loop profiles in improving the sweep stiffness of wire bond
Kung, H.K., Huang, C.H., Chanyshev, A.I.Year:
2006
Language:
english
DOI:
10.1109/eptc.2006.342759
File:
PDF, 223 KB
english, 2006