[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Development of new 2.5D package with novel integrated organic interposer substrate with ultra-fine wiring and high density bumps
Oi, Kiyoshi, Otake, Satoshi, Shimizu, Noriyoshi, Watanabe, Shoji, Kunimoto, Yuji, Kurihara, Takashi, Koyama, Toshinori, Tanaka, Masato, Aryasomayajula, Lavanya, Kutlu, ZaferYear:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897310
File:
PDF, 1.39 MB
english, 2014