[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China...

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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Development of a three-dimensional integrated solder ball bumping & bonding method for MEMS devices

Yang, Lei, Liu, Wei, Wang, Chunqing, Tian, Yanhong
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Year:
2011
Language:
english
DOI:
10.1109/icept.2011.6066935
File:
PDF, 1.97 MB
english, 2011
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