[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Development of a three-dimensional integrated solder ball bumping & bonding method for MEMS devices
Yang, Lei, Liu, Wei, Wang, Chunqing, Tian, YanhongYear:
2011
Language:
english
DOI:
10.1109/icept.2011.6066935
File:
PDF, 1.97 MB
english, 2011