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[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Effects of anisotropic conductive adhesive (ACA) material properties on package reliability performance [flip-chip interconnects]
Teo, M., Mhaisalkar, S.G., Wong, E.H., Poi-Siong Teo,, Wong, C.C., Ong, K., Chin Foo Goh,Year:
2003
Language:
english
DOI:
10.1109/eptc.2003.1271612
File:
PDF, 415 KB
english, 2003