[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - A novel sample preparation technique for 3D_IC micro-bumps for wider region observation
Han-Yun Long,, King-Ting Chiang,, Chun-An Huang,, Li Chuang,, Ming-Lun Chang,, Jandel Lin,Year:
2012
Language:
english
DOI:
10.1109/impact.2012.6420269
File:
PDF, 6.27 MB
english, 2012