[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - Reliability and failure analysis study of multi-die embedded micro wafer level packages
Sekhar, V. N., Rao, V. S., Sharma, Gaurav, Rajoo, Ranjan, Serene Thew Mei Ling,, Khong Chee Houe,, Chong Ser Choong,, Cheng Cheng Kuo,Year:
2010
Language:
english
DOI:
10.1109/eptc.2010.5702722
File:
PDF, 2.69 MB
english, 2010