[IEEE 2010 12th Electronics Packaging Technology Conference...

  • Main
  • [IEEE 2010 12th Electronics Packaging...

[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - Reliability and failure analysis study of multi-die embedded micro wafer level packages

Sekhar, V. N., Rao, V. S., Sharma, Gaurav, Rajoo, Ranjan, Serene Thew Mei Ling,, Khong Chee Houe,, Chong Ser Choong,, Cheng Cheng Kuo,
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2010
Language:
english
DOI:
10.1109/eptc.2010.5702722
File:
PDF, 2.69 MB
english, 2010
Conversion to is in progress
Conversion to is failed