[IEEE 2013 8th International Microsystems, Packaging,...

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[IEEE 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2013.10.22-2013.10.25)] 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - A novel and green electroless copper

Chow, Andy, Wu, David, Li, Crystal, Yee, Dennis
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Year:
2013
Language:
english
DOI:
10.1109/impact.2013.6706622
File:
PDF, 1.05 MB
english, 2013
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