All-Solution Thin-film Capacitors and Their Deposition in...

IEEE Transactions on Components Packaging and Manufacturing Technology 2013 / 04 Vol. 3; Iss. 4

All-Solution Thin-film Capacitors and Their Deposition in Trench and Through-Via Structures

Wang, Yushu, Xiang, Shu, Pulugurtha, Markondeya Raj, Sharma, Himani, Williams, Byron, Tummala, Rao
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Volume:
3
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2012.2227963
Date:
April, 2013
File:
PDF, 1.61 MB
english, 2013
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