![](/img/cover-not-exists.png)
[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Cost and performance effective silicon interposer and Vertical Interconnect for 3D ASIC and memory integration
Li, Li, Higashi, Mitsutoshi, Takano, Akihito, Xue, Jie, Ikari, GaryYear:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897470
File:
PDF, 7.06 MB
english, 2014