[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Thermal stress simulation in the metal-insulator-metal (MIM) wafer fabrication process
Yumin Liu,, Yong Liu,, Scott Irving,, Timwah Luk,Year:
2008
Language:
english
DOI:
10.1109/ectc.2008.4550107
File:
PDF, 521 KB
english, 2008