![](/img/cover-not-exists.png)
[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Curing mechanism and thermal properties of a certain liquid crystalline epoxy resin cured with different curing agents
Kun, Guo, Xiaoliang, Zeng, Shuhui, Yu, Rong, Sun, Jianbin, XuYear:
2014
Language:
english
DOI:
10.1109/icept.2014.6922659
File:
PDF, 384 KB
english, 2014