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[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Study on the microstructure and the Shear Strength of Sn-0.7Cu-xZn
Gao, Yan-jun, Luo, Zhong-bing, Zhao, Jie, Wang, LaiYear:
2009
Language:
english
DOI:
10.1109/icept.2009.5270550
File:
PDF, 2.66 MB
english, 2009