[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Comments on electromigration analysis methods
Zhu, X., Kotadia, H., Xu, S., Lu, H., Mannan, S. H., Bailey, C., Chan, Y. C.Year:
2013
Language:
english
DOI:
10.1109/icept.2013.6756527
File:
PDF, 384 KB
english, 2013