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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Manufacture, microstructure and microhardness analysis of Sn-Bi lead-free solder reinforced with Sn-Ag-Cu nano-particles
Lili Zhang,, Wenkai Tao,, Johan Liu,, Yan Zhang,, Zhaonian Cheng,, Andersson, Cristina, Yulai Gao,, Qijie Zhai,Year:
2008
Language:
english
DOI:
10.1109/icept.2008.4607057
File:
PDF, 1.67 MB
english, 2008