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[IEEE Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268) - Norrkoping, Sweden (26-30 Oct. 1997)] Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268) - High frequency measurements and simulations on wire-bonded modules on the sequential build-up boards (SBU)
Sihlbom, R., Dernevik, M., Lindgren, M., Starski, P., Lai, Z., Liu, J.Year:
1997
Language:
english
DOI:
10.1109/pep.1997.656483
File:
PDF, 527 KB
english, 1997