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[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - A Novel 20-100 /spl mu/m Pitch IC-to-Package Interconnect and Assembly Process for Pb-Free Solder, Copper or Gold Stud Bumps
Jui-Yun Tsai,, Sundaram, V., Wiedenman, B., Yangyang Sun,, Wong, C.P., Rao Tummala,Year:
2006
Language:
english
DOI:
10.1109/ectc.2006.1645657
File:
PDF, 442 KB
english, 2006