[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Heat dissipation design for a high density-high power chip package
Zhou, Jing, Cao, Liqiang, Guo, Xueping, Wang, Qidong, Guidotti, Daniel, Jing, Xiangmeng, Yu, Daquan, Wan, LixiYear:
2011
Language:
english
DOI:
10.1109/icept.2011.6066897
File:
PDF, 3.15 MB
english, 2011