[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Interfacial stress in Through Silicon Vias
Li, Wei, Qin, Fei, An, Tong, Wu, Wei, Liu, Chengyan, Wan, Lixi, Yu, Daquan, Wang, JunYear:
2012
Language:
english
DOI:
10.1109/icept-hdp.2012.6474691
File:
PDF, 1.17 MB
english, 2012