[IEEE 2013 IEEE 15th International Symposium and Exhibition on Advanced Packaging Materials (APM 2013) - Irvine, CA (2013.2.27-2013.3.1)] 2013 IEEE International Symposium on Advanced Packaging Materials - Next generation transition liquid phase sintering pastes for Z-Axis interconnection in sub-400 micron pitch high density interconnect
Shearer, Catherine, Holcomb, K., Friesen, D.Year:
2013
Language:
english
DOI:
10.1109/isapm.2013.6510400
File:
PDF, 1.79 MB
english, 2013