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[IEEE 2008 Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Seoul, Korea (South) (2008.12.10-2008.12.12)] 2008 Electrical Design of Advanced Packaging and Systems Symposium - A delay estimation method using reduced model of RLC interconnects
Park, Chang-Woo, Jeong, Moon-Sung, Kim, Ki-Young, Kim, Seok-YoonYear:
2008
Language:
english
DOI:
10.1109/edaps.2008.4736040
File:
PDF, 990 KB
english, 2008