[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Electrical characterization of fine-pitch compliant bumps
Lin, C. K., Chen, Chih, Chang, Shyh-Ming, An, Chao-Chyun, Lee, Hsiao Ting, Kao, Kuo-Shu, Tsang, Jimmy, Yang, Sheng-ShuYear:
2008
Language:
english
DOI:
10.1109/eptc.2008.4763500
File:
PDF, 3.76 MB
english, 2008