![](/img/cover-not-exists.png)
[IEEE 2007 IEEE International Interconnect Technology Conferencee - Burlingame, CA, USA (2007.06.4-2007.06.6)] 2007 IEEE International Interconnect Technology Conferencee - A Study of Adhesion and Improvement of Adhesion Energy Using Hybrid Low-k (porous-PAr/ porous-SiOC(k=2.3/2.3)) Structures with Multi-layered Cu Interconnects for 45-nm Node Devices
Usami, T., Maruyama, C., Tagami, M., Watanabe, K., Kameshima, T., Masuda, H., Shimada, M., Gawase, A., Kagawa, Y., Nakamura, N., Miyajima, H., Naruse, H., Enomoto, Y., Kitano, T., Sekine, M.Year:
2007
Language:
english
DOI:
10.1109/iitc.2007.382358
File:
PDF, 6.35 MB
english, 2007