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[IEEE 30th Annual Proceedings Reliability Physics 1992 - San Diego, CA, USA (1992.03.31-1992.04.2)] 30th Annual Proceedings Reliability Physics 1992 - Comparison of electromigration reliability of tungsten and aluminum vias under DC and time-varying current stressing
Tao, J., Young, K.K., Cheung, N.W., Hu, C.Year:
1992
DOI:
10.1109/relphy.1992.187667
File:
PDF, 435 KB
1992