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[IEEE 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2013.10.22-2013.10.25)] 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - 300-Mm wafer 3D integration technology using hybrid wafer bonding
Hozawa, Kazuyuki, Aoki, Mayu, Hanaoka, Yuko, Takeda, KenichiYear:
2013
Language:
english
DOI:
10.1109/impact.2013.6706626
File:
PDF, 842 KB
english, 2013