[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Ultrasound-assisted brazing of large area Cu/Al dissimilar metals used for package heat dissipation substrate
Xiao, Yong, Li, Mingyu, Kim, JongmyungYear:
2013
Language:
english
DOI:
10.1109/icept.2013.6756554
File:
PDF, 4.16 MB
english, 2013