[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Reliability of Sn-3.5Ag solder joints in high temperature packaging applications
Muralidharan, Govindarajan, Kurumaddali, Kanth, Kercher, Andrew K., Leslie, Scott G.Year:
2010
Language:
english
DOI:
10.1109/ectc.2010.5490717
File:
PDF, 1.65 MB
english, 2010