[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Error analysis for piezoresistive stress sensors used in flip chip packaging
Hussain, Safina, Jaeger, Richard C., Suhling, Jeffrey C., Roberts, Jordan C., Motalab, Mohammad A., Cho, Chun-HyungYear:
2010
Language:
english
DOI:
10.1109/itherm.2010.5501287
File:
PDF, 1.13 MB
english, 2010