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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Corrosion of Sn-0.75Cu solder and Sn-0.75Cu/Cu joint in salt solutions
Gao, Yanfang, Cheng, Congqian, Huang, Mingliang, Wang, Lihua, Zhao, JieYear:
2011
Language:
english
DOI:
10.1109/icept.2011.6066979
File:
PDF, 1.31 MB
english, 2011