Development of the wafer level compressive-flow underfill...

IEEE Transactions on Electronics Packaging Manufacturing 1999 / 10 Vol. 22; Iss. 4

Development of the wafer level compressive-flow underfill process and its involved materials

Songhua Shi,, Yamashita, T., Wong, C.P.
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Volume:
22
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/6104.816094
Date:
October, 1999
File:
PDF, 136 KB
english, 1999
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