[IEEE IEEE 43rd Electronic Components and Technology Conference (ECTC '93) - Orlando, FL, USA (1-4 June 1993)] Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) - Thermal enhancement of surface mount electronic packages with heat sinks
Shaukatullah, H., Gaynes, M.A., White, L.H.Year:
1993
Language:
english
DOI:
10.1109/ectc.1993.346832
File:
PDF, 590 KB
english, 1993