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[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Nanoindentation investigation of copper bonding wire and ball
Fan, Xiangquan, Qian, Kaiyou, Wang, Techun, Cong, Yuqi, Zhao, Mike, Zhang, Binhai, Wang, JiajiYear:
2009
Language:
english
DOI:
10.1109/icept.2009.5270642
File:
PDF, 1.41 MB
english, 2009