[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Localized heating and bond formation at solder/Cu interface induced by ultrasonic friction
Zhuolin Li,, Mingyu Li,, Kim, Jongmyung, Hongbae Kim,Year:
2012
Language:
english
DOI:
10.1109/emap.2012.6507863
File:
PDF, 756 KB
english, 2012