Analysis of Multilayered Microelectronic Packaging Under...

IEEE Transactions on Components and Packaging Technologies 2006 / 12 Vol. 29; Iss. 4

Analysis of Multilayered Microelectronic Packaging Under Thermal Gradient Loading

Basaran, Cemal, Wen, Yujun
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Volume:
29
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2006.885966
Date:
December, 2006
File:
PDF, 422 KB
english, 2006
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